2019 International Conference on Material Science and Semiconductor Devices (MSSD2019) will be held on November 15-17, 2019 in Shenzhen, China. The aim is to provide an international platform for experts, engineers, researchers in material science and semiconductor devices to share research results and advanced technology. The conference also discusses the trend of academic development and helps to bridge the R&D results with industry. Another goal is to promote the establishing of business or research relations among global partners for future collaboration.
We sincerely invite you to participate in MSSD 2019 and hope this event could meet and exceed your anticipation.
2019年材料科学与半导体器件国际会议（MSSD2019） 将于2019年11月15日至17日在中国深圳隆重举行。会议主要围绕材料科学与半导体器件等研究领域展开讨论。会议旨在为从事材料科学与半导体器件研究的专家学者、工程技术人员、技术研发人员提供一个共享科研成果和前沿技术，了解学术发展趋势，拓宽研究思路，加强学术研究和探讨，促进学术成果产业化合作的平台。
大会诚邀国内外高校、科研机构专家、学者，企业界人士及其他相关人员参会交流。
1.EI（EI会议论文）
* All submissions will be peer reviewed, and the accepted papers will be published in the IOP Conference Series: Materials Science and
Engineering(MSE) (ISSN:1757-8981) and will be submitted to EI Compendex (CPX), SCOPUS, CPCI for indexing.
所有的投稿都必须经过2-3位组委会专家严格审核之后，最终所录用的论文将被EI目录系列期刊IOP Conference Series: Materials Science and
Engineering(MSE) (ISSN:1757-8981)出版， 见刊后将被EI，Scopus，CPCI检索。
* All submissions must not be less than 4 pages in length.
EI会议论文不得少于4页。
* EI Template Download：
Template-IOP.rar
2. SCI Journals
* We also call for papers for SCI journals.
额外征集10篇优秀论文发表到SCI期刊，录满截止，欢迎投稿！
期刊1（IF约1.6）：物理科学应用、理论、性能研究、实验的所有领域。
期刊2（IF约2.4）：应用物理学、材料物理、半导体、磁性。
期刊3（IF约1.3）：国防技术相关。
期刊4（IF约2.2）：电子领域的新材料和技术。
* All submissions must not be less than 10 pages in length，and papers should be submitted to service@keoaeic.org,
and noted "SCI-ICMSSD".
所有提交SCI的论文不得少于10页, 只能通过邮箱service@keoaeic.org投稿，并且投稿的时候务必备注“SCI稿件-ICMSSD”。
* English Template（
Template-SCI-EN.doc）
中文模板（Template-SCI-CN.doc）
* 本会议是AEIC学术交流资讯中心系列会议，均已经在科学网和中国知网发布。更多AEIC学术交流资讯中心系列会议，请打开AEIC官网。
如需AEIC期刊服务和编译服务，请点击:click。
2019 International Conference on Material Science and Semiconductor Devices (MSSD2019)accepts original and unpublished papers. Please submit your papers as the following instructions:
Submission Methods
1.Full Paper (Presentation and Publication)
Accepted full papers will be invited to give the oral presentation at the conference and be publsihed in one of the Journals / conference proceeding.
EI Paper Template (Template-IOP.rar)
*All submissions must not be less than 6 pages in length.
SCI Paper Template (English) (Chinese)
*All submissions must not be less than 10 pages in length.
2.Abstract (Presentation only)
Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.
3.Submission Methods (Only select one way to submit/只选其中一种方式投稿)
Note:
（1）Papers submitted to the conference should be in English.
（2）Both Abstract and Full Paper are welcomed. The author can make an oral presentation after the Abstract is accepted
and the payment is finished.
（3）All submitted articles should report original, previously unpublished research results, experimental or theoretical.
Articles submitted to the conference should meet these criteria and must not be under consideration for publication elsewhere.
We firmly believe that ethical conduct is the most essential virtual of any academic. Hence any act of plagiarism is a totally .
