welcome to ISAEECE2019

Paper Submission

Welcome you to submit the full paper by
Submission System before 05/10/2019

Countdown Days

0

Important Dates

Conference Date: 05/17 - 05/19/2019

Submission Deadline:

05/10/2019


ISAEECE 2019会议被湘潭大学计算机科学与技术学科服务平台收录并推荐!


Welcome to the official website of 2019 4th International Symposium on Advances in Electrical, Electronics and Computer Engineering (ISAEECE 2019).


The previous First International Symposium on Advances in Electrical, Electronics and Computer Engineering (ISAEECE 2016) was successfully taken place on March 12-13, 2016 in Guangzhou, China. All accepted papers were published by Advances in Engineering Research (ISSN 2352-5401) and have been indexed by CPCI.

The previous second International Symposium on Advances in Electrical, Electronics and Computer Engineering (ISAEECE 2017) was successfully taken place on March 25-26, 2017 in Guangzhou, China. All accepted papers were published by Advances in Engineering Research (ISSN 2352-5401) and have been indexed by CPCI.

The 2018 3rd International Symposium on Advances in Electrical, Electronics and Computer Engineering (ISAEECE 2018) was successfully taken place on April 13-15, 2018 in Hangzhou, China. All accepted full papers were published in Conference Proceedings and were submitted to Ei Compendex, Scopus and CPCI for indexing.


The 2019 4th International Symposium on Advances in Electrical, Electronics and Computer Engineering (ISAEECE 2019) will be held on May 17-19, 2019 in Zhuhai, China.ISAEECE 2019 is to bring together innovative academics and industrial experts in the field of electrical, electronics and computer engineering to a common forum. The primary goal of the conference is to promote research and developmental activities in electrical, electronics and computer engineering and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in electrical, electronics and computer engineering and related areas. 


IOP.png

1. All accepted full papers will be published in IOP Conference Series: Materials Science and Engineering (MSE)(ISSN: 1757-8981) and will be submitted to EI Compendex, Scopus, Inspec, DOAJ and CPCI for indexing.

所有的投稿都必须经过2-3位组委会专家审稿,经过严格的审稿之后,最终所有录用的论文将由EI目录系列期刊 IOP Conference Series: Materials Science and Engineering (MSE)(ISSN: 1757-8981) 出版,见刊后由期刊社提交至EI和CPCI检索,目前该期刊EI检索非常稳定。


ISAEECE2016:检索记录

ISAEECE2017:检索记录

ISAEECE2018:检索记录


* EI Template Download:Template-IOP.rar

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2.Selected 10 papers will be recommended for publication in SCI journal. 推荐10篇优秀论文到SCI期刊,录满截止,欢迎投稿!

期刊1 (IF约1.8):基于数据背景下的图像和视频处理领域

期刊2 (IF约0.8):A:计算机科学理论,方法和工具; B:计算机和通信网络和系统; C:计算智能,机器学习和数据分析; D:计算机系统和网络的安全性

期刊3 (IF约0.5):计算机技术应用于材料、结构工程;物联网;数据(大数据、数据管理和储存);无线通讯技术;人工智能相关主题


SCI Template Download:SCI期刊论文中英模板.rar

*All submissions must not be less than 10 pages in lengthand papers should be submitted to ISAEECE@163.com , and noted SCI.


本会议是AEIC学术交流资讯中心系列会议,均已在科学网和中国知网发布。更多AEIC学术交流资讯中心系列会议,请打开AEIC官网。如需AEIC期刊服务和编译服务,请点击(click)。


1. The submitted papers must not be under consideration elsewhere.

2. All papers to be considered by ICSP can be submitted  AEIC SUBMISSION SYSTEM Or you can submit your paper and Paper Submission Form(英文) to ISAEECE@163.com.

或采用邮件的方式,把论文初稿作者登记表(中文)发送到  ISAEECE@163.com. (word and pdf)。

3. Please submit the full paper, if presentation and publication are both needed.

4. Please submit the abstract only, if you just want to make presentations.

5. Should you have any questions, please contact us at ISAEECE@163.com.


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